Leading the 4G and 5G chip and module ecosystems
GCT launches 2025GCT program to commence “Year of 5G” and celebrate upcoming 5G chipset shipments
GCT Rings Closing Bell at the NYSE
On April 26, 2024, the GCT team with CEO John Schlaefer rang the closing bell at the NYSE, celebrating the listing of GCTS. Watch the video. Congratulations!
Advanced LTE connectivity for the ultimate mobile experience
GCT’s 4G LTE chips and modules enable superior high-speed LTE connectivity to commercial devices worldwide. Our market-proven solutions, certified by top operators, are optimized for numerous applications such as smartphones, tablets, hotspots, USB dongles, routers, M2M, IoT devices and more.
FEATURED NEWS
GCT Semiconductor Participates in Exclusive Aramco Digital and 450 MHz Alliance Event on Innovations in Private Networks
The event, held January 20-22 in Dhahran, Kingdom of Saudi Arabia, focuses on the advancements in private networks leveraging the 450 MHz spectrum
SAN JOSE, CA– January 17, 2025 – GCT Semiconductor Holding Inc. (“GCT” or the “Company”) (NYSE: GCTS), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, announced today the participation in the Aramco Digital event, held in collaboration with the 450 MHz Alliance, on January 20-22 at the Sofitel Al Khobar The Corniche Hotel in Dhahran, Saudi Arabia. GCT will gather with industry leaders and innovators to discuss the global evolution and next generation of 450 MHz solutions.
GCT Semiconductor Holding, Inc. Signs Strategic Definitive Agreement with European Tier One Telecommunications Supplier
The Agreement with European Tier One Supplier Further Accelerates GCT’s momentum in 5G chipset development with strategic partners
SAN JOSE, CA– November 25, 2024 – GCT Semiconductor Holding Inc. (“GCT” or the “Company”) (NYSE: GCTS), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, announced today the signing of a definitive agreement with a European tier one wireless infrastructure and terminal provider (the “Tier One Supplier”) to collaborate on the development of Fixed Wireless Access (“FWA”) technology using GCT’s 5G solutions including modem chipset and RFIC.
GCT Semiconductor Holding, Inc. Signs MOU with Global Tier One Telecommunications Supplier
The Agreement with Global Tier One Supplier Includes Development Collaboration on Fixed Wireless Access Devices Using GCT’s 5G Chipsets
SAN JOSE, CA– August 20, 2024 – GCT Semiconductor Holding Inc. (“GCT” or the “Company”) (NYSE: GCTS), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, announced today the execution of a memorandum of understanding (“MOU”) with a tier one worldwide infrastructure and terminal provider (the “Tier One Supplier”) to collaborate on the development of Fixed Wireless Access (“FWA”) technology using GCT’s 5G solutions including modem chipset and RFIC. The Company expects to close a definitive agreement before the end of 2024.
GCT Semiconductor signs MOU with Samsung to accelerate the development of 4G/5G chipsets and modules
GCT aims to advance 4G/5G solutions and further expand its ecosystem worldwide
SAN JOSE, CA – August 13, 2024 –GCT Semiconductor Holding Inc. (“GCT”) (NYSE: GCTS), a leading designer and supplier of advanced 4G and 5G semiconductor solutions, today announced the signing of a Memorandum of Understanding (MOU) with Samsung Electronics Co., Ltd (Samsung) that aims to accelerate the development of 4G/5G chipsets and modules, as well as drive the adoption by device makers.
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